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cld-ds39 rev 6 product family data sheet copyright ? 2010-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ? , the cree logo and xlamp ? are registered trademarks of cree, inc. www. cree.com/xlamp cree, inc. 4600 silicon drive durham, nc 27703 usa tel: +1.919.313.5300 cree ? xlamp ? ml-b leds product description the cree xlamp m l-b led brings lighting-class reliability and performance to 1/4-watt le ds. the xlamp m l-b expands crees lighting-class leadership to linear and distributed lighting applications. w ith xlamp lighting- class reliability, a wide viewing angle, uniform light output, and industry-leading chromaticity binning in a 3.5-mm x 3.5 -mm package, the xlamp m l-b le d continues crees history of segment-focused product innovation in l e ds for lighting applications. the xlamp m l-b le d brings high performance and a smooth look to a wide range of lighting applications, including linear lighting, fuorescent retrofts and retail-display lighting. features ? available in white (2200 k and 2600 k to 8300 k cct) and 80-, 85- and 90-cri minimum ? ansi-compatible sub-bins ? maximum drive current: 175 ma ? 120 viewing angle, uniform chromaticity profile ? electrically neutral thermal path ? rohs and reach-compliant ? ul-recognized component (e349212) table of contents characteristics ........................... 2 flux characteristics ..................... 2 relative spectral p ower distribution ................................ 3 relative flux vs. junction temperature .............................. 3 e lectrical characteristics .............. 4 relative flux vs. current ............. 4 thermal design .......................... 5 typical spatial distribution ........... 5 refow soldering characteristics ... 6 notes ........................................ 7 mechanical dimensions ................ 9 tape and reel ........................... 10 p ackaging ................................. 11
2 characteristics characteristics unit minimum typical maximum thermal resistance, junction to solder point c/w 25 viewing angle (fwhm) degrees 120 temperature coeffcient of voltage mv/c -3.5 esd classifcation (hbm per mil-std-883d) class 2 dc forward current ma 175 reverse voltage v 5 forward voltage (@ 80 ma) v 3.3 3.5 le d junction temperature c 150 flux characteristics (t j = 25 c) the following table provides several base order codes for xlamp m l-b le ds. it is important to note that the base order codes listed here are a subset of the total available order codes for the product family. for more order codes, as well as a complete description of the order-code nomenclature, please consult the xlamp m l-b le d binning and labeling document. color cct range base order codes min. luminous flux (lm) @ 80 ma order code min. max. group flux (lm) cool white 4500 k 8300 k j0 23.5 mlba w t-a1-0000-000w51 w arm white 3700 k 4300 k j0 23.5 mlba w t-a1-0000-000we5 h0 18.1 mlba w t-a1-0000-000ve5 2800 k 3200 k j0 23.5 mlba w t-a1-0000-000we7 h0 18.1 mlba w t-a1-0000-000ve7 2000 k 2400 k g0 13.9 mlba w t-a1-0000-000uea 80-cri w arm white 3700 k 4300 k h0 18.1 mlbawt-h1-0000-000ve5 2800 k 3200 k h0 18.1 MLBAWT-H1-0000-000VE7 85-cri w arm white 3700 k 4300 k h0 18.1 mlba w t-p1-0000-000ve5 2800 k 3200 k h0 18.1 mlba w t-p1-0000-000ve7 90-cri w arm white 3700 k 4300 k h0 18.1 mlba w t-u1-0000-000ve5 2800 k 3200 k h0 18.1 mlba w t-u1-0000-000ve7 notes: ? cree maintains a tolerance of 7% on fux measurements, 0.005 on chromaticity (ccx, ccy) measurements and 2% for cri measurements, ? typical cri for cool white (4300 k C 8300 k cct) is 75. ? typical cri for warm white (2600 k C 4300 k cct) is 80. ? minimum cri for 80-cri white is 80. ? minimum cri for 85-cri white is 85. ? minimum cri for 90-cri white is 90. copyright ? 2010-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ? , the cree logo and xlamp ? are registered trademarks of cree, inc. xlamp ml-b leds
3 relative spectral power distribution relative flux vs. junction temperature (i f = 80 ma) 0 20 40 60 80 100 400 450 500 550 600 650 700 750 relative radiant power (%) wavelength (nm) 5000k - 8300k cct 3500k - 5000k cct 2600k - 3500k cct 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 25 50 75 100 125 150 relative luminous flux junction temperature (oc) copyright ? 2010-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ? , the cree logo and xlamp ? are registered trademarks of cree, inc. xlamp ml-b leds
4 electrical characteristics (t j = 25 c) relative flux vs. current (t j = 25 c) 0 20 40 60 80 100 120 140 160 180 2.50 2.75 3.00 3.25 3.50 3.75 4.00 forward current (ma) forward voltage (v) 0% 20% 40% 60% 80% 100% 120% 140% 160% 180% 200% 0 25 50 75 100 125 150 175 relative luminous flux (%) forward current (ma) copyright ? 2010-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ? , the cree logo and xlamp ? are registered trademarks of cree, inc. xlamp ml-b leds
5 thermal design the maximum forward current is determined by the thermal resistance between the l e d junction and ambient. it is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics. typical spatial distribution 0 20 40 60 80 100 120 140 160 180 200 0 25 50 75 100 125 150 maximum current (ma) ambient temperature (oc) rj - a = 30 c/w rj - a = 40 c/w rj - a = 50 c/w rj - a = 60 c/w 0 20 40 60 80 100 - 90 - 70 - 50 - 30 - 10 10 30 50 70 90 relative luminous intensity (%) angle (o) copyright ? 2010-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ? , the cree logo and xlamp ? are registered trademarks of cree, inc. xlamp ml-b leds
6 reflow soldering characteristics in testing, cree has found xlamp m l-b le ds to be compatible with jede c j-std-020c, using the parameters listed below. as a general guideline, cree recommends that users follow the recommended soldering profle provided by the manufacturer of solder paste used. note that this general guideline may not apply to all pcb designs and confgurations of refow soldering equipment. profle feature lead-based solder lead-free solder average ramp-up rate (ts max to tp) 3 c/second max. 3 c/second max. preheat: temperature min (ts min ) 100 c 150 c preheat: temperature max (ts max ) 150 c 200 c preheat: time (ts min to ts max ) 60-120 seconds 60-180 seconds time maintained above: temperature (t l ) 183 c 217 c time maintained above: time (t l ) 60-150 seconds 60-150 seconds peak/classifcation temperature (tp) 215 c 260 c time within 5 c of actual peak temperature (tp) 10-30 seconds 20-40 seconds ramp-down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note: all temperatures refer to topside of the package, measured on the package body surface. note: while the high refow temperatures (above) have been approved, crees best practice guideline for refow is to use as low a temperature as possible during the refow soldering process for these leds. copyright ? 2010-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ? , the cree logo and xlamp ? are registered trademarks of cree, inc. xlamp ml-b leds
7 notes l umen m aintenance projections cree now uses standardized ies lm-80-08 and tm-21-11 methods for collecting long-term data and extrapolating led lumen maintenance. for information on the specifc lm-80 data sets available for this led, refer to the public lm-80 results document at www.cree.com/xlamp_app_notes/lm80_results. p lease read the xlamp long-term lumen m aintenance application note at www.cree.com/xlamp_app_notes/lumen_ maintenance for more details on crees lumen maintenance testing and forecasting. p lease read the xlamp thermal m anagement application note at www.cree.com/xlamp_app_notes/thermal_management for details on how thermal design, ambient temperature, and drive current affect the l e d junction temperature. m oisture s ensitivity xlamp m l-b le ds are shipped in sealed, moisture-barrier bags (mbb) designed for long shelf life. if xlamp ml-b leds are exposed to moist environments after opening the mbb packaging but before soldering, damage to the l e d may occur during the soldering operation. the derating table at right defnes the maximum exposure time (in days) for an xlamp ml-b led in the listed humidity and temperature conditions. leds with exposure time longer than the time specifed below must be baked according to the baking conditions listed below. cree recommends keeping xlamp l e ds in their sealed moisture-barrier packaging until immediately prior to use. cree also recommends returning any unused l e ds to the resealable moisture-barrier bag and closing the bag immediately after use. baking c onditions it is not necessary to bake all xlamp m l-b leds. only the le ds that meet all of the following criteria must be baked: 1. le ds that have been removed from the original mbb packaging. 2. le ds that have been exposed to a humid environment longer than listed in the m oisture sensitivity section above. 3. le ds that have not been soldered. le ds should be baked at 70 oc for 24 hours. l e ds may be baked on the original reels. remove le ds from m bb packaging before baking. do not bake parts at temperatures higher than 70 oc. this baking operation resets the exposure time as defned in the moisture sensitivity section above. temp. maximum percent relative humidity 30% 40% 50% 60% 70% 80% 90% 35 oc - - - 17 1 .5 .5 30 oc - - - 28 1 1 1 25 oc - - - - 2 1 1 20 oc - - - - 2 1 1 copyright ? 2010-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ? , the cree logo and xlamp ? are registered trademarks of cree, inc. xlamp ml-b leds
8 s torage c onditions xlamp m l-b le ds that have been removed from the original m bb packaging but not soldered should be stored in one of the following ways: ? store the parts in a rigid metal container with a tight-ftting lid. verify that the storage temperature is <30 c, and place fresh desiccant and an rh indicator in the container to verify that the rh is no greater than 60%. ? store the parts in a dry, nitrogen-purged cabinet or container that actively maintains the temperature at <30 and the rh at no greater than 60%. ? for short-term store only: l e ds can be resealed in the original m bb bag soon after opening. fresh desiccant may be needed. use the included humidity indicator card to verify <60% rh. if an environment of <60% rh is not available for storage, xlamp ml-b leds should be baked (described above) before refow soldering. r o hs c ompliance the levels of rohs restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with eu directive 2011/65/ec (rohs2), as amended through june 8, 2011. rohs declarations for this product can be obtain from your cree representative or obtained from the product e cology section of www.cree.com. reac h c ompliance reach substances of high concern (svhcs) information is available for this product. since the european chemical agency (echa) has published notices of their intent to frequently revise the svhc listing for the foreseeable future, please contact a cree representative to insure you get the most up-to-date reach declaration. historical reach banned substance information (substances restricted or banned in the eu prior to 2010) is also a vailable upon request. ul r ecognized c omponent level 4 enclosure consideration. the led package or a portion thereof has been investigated as a fre and electrical enclosure per ansi/ul 8750. v ision a dvisory c laim w arning. do not look at exposed l e d lamps in operation. e ye injury can result. for more information about le ds and eye safety, please refer to the cree led eye safety application note (www.cree.com/xlamp_app_notes/led_eye_safety). copyright ? 2010-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ? , the cree logo and xlamp ? are registered trademarks of cree, inc. xlamp ml-b leds
9 mechanical dimensions (t a = 25 c) all measurements are .13 mm unless otherwise indicated. recommended fr4 solder p ad mx3535 pad layout top view bottom view side view top view recommended mcpcb solder p ad alternative solder p ad copyright ? 2010-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ? , the cree logo and xlamp ? are registered trademarks of cree, inc. xlamp ml-b leds
10 tape and reel all cree carrier tapes conform to eia-481d, automated component handling systems standard. all dimensions in mm. loaded pockets (1,000 lamps) leader 400mm (min) of empty pockets with at least 100mm sealed by tape (50 empty pockets min.) trailer 160mm (min) of empty pockets sealed with tape (20 pockets min.) start end cathode side anode side (denoted by + and circle) 160.0 a a b 2.5 .1 section a-a scale 2 : 1 1.5 .1 8.0 .1 4.0 .1 1.75 .10 12.0 .0 + .3 detail b scale 2 : 1 13 mm 7" cover tape pocket tape user feed direction user feed direction size title of rev. sheet c drawing no. date date date check final protective finish material approved drawn by third angle projection scale a b c d 1 2 3 4 5 6 6 5 4 3 2 1 a b c d phone (919) 313-5300 fax (919) 313-5558 4600 silicon drive durham, n.c 27703 unauthorized person without the written consent may not be copied, reproduced or disclosed to any confidential information of cree, inc. this plot contained within are the proprietary and cree confidential. this plot and the information of cree inc. notice x .5 .xxx .25 .xx .75 .x 1.5 for sheet metal parts only .xx .25 .xxx .125 x .5 unless otherwise specified dimensions are in millimeters and after finish. tolerance unless specified: surface finish: 1.6 (8 ) (12 ) (1.75 ) (4 ) ( ) 1.5 (1.55 ) trailer loaded pockets leader 2 / 1 4.000 b 2402-00005 carrier loading specification-mx6 7/1/09 d. seibel revisons rev description by date app'd a released j.l. 7/1/09 b added cathode and anode notes dc 2/26/12 160mm (min) of empty pockets sealed with tape (20 pockets min.) 400mm (min) of empty pockets with at least 100mm sealed by tape (50 empty pockets min.) (1,400 pcs /reel cathode side anode side cathode mark copyright ? 2010-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ? , the cree logo and xlamp ? are registered trademarks of cree, inc. xlamp ml-b leds
11 packaging patent label (on bottom of box) label with cree bin code, qty, reel id label with cree bin code, qty, reel id label with cree order code, qty, reel id, po # label with cree order code, qty, reel id, po # label with cree bin code, qty, reel id unpackaged reel packaged reel boxed reel cree bin code & barcode label vacuum-sealed moisture barrier bag label with customer p/n, qty, lot #, po # label with cree bin code, q t y , lot # label with cree bin code, q t y , lot # v acuum - sealed moisture barrier bag p atent label label with customer order code, q t y , r eel i d , po # humidity indicator card (inside bag) dessicant (inside bag) copyright ? 2010-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ? , the cree logo and xlamp ? are registered trademarks of cree, inc. xlamp ml-b leds

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